ICT-TC-GFSP-US-4011
formerly ICT-FSL-BS
Thermally Conductive Spacer ICT-TC-GFSP-US-4011
ICT-TC-GFSP-US-4011 is a ultrasoft, thermally conductive gap-filler-spacer with which very good thermal connections can be realized via large gaps, for example by height differences of electronic components or large tolerances.
The elastomer has a very high elasticity, high dielectric strength and excellent high thermal conductivity, which is achieved due to a first-class and balanced careful selection of proprietary ceramic fillers in conjunction with ceramic powder
Product properties for ICT-TC-GFSP-US-4011(*)
| Property | Value | Test Method |
|---|---|---|
| Thermal Properties | ||
| Operating temperature | from -60 to 180 °C | OEM/ICT |
| Thermally conductive | Yes | OEM/ICT |
| Thermal conductivity | 3 W/m*K | ASTM D 5470 |
| Thermal resistance (inch² / 645,16mm²) | 0.290.60.891.2 | OEM/ICT |
| General Properties | ||
| Density | 2.8 g/cm³ | ASTM D 792 |
| Color | Light Blue | Visual |
| Electrical Properties | ||
| Dielectric breakdown voltage | 10.00 kV/mm | ASTM D 149 |
| Electrically conductive | No | OEM/ICT |
| Mechanical Properties | ||
| Hardness (Shore 00) | 30 | ASTM D 2240 |
Variants (*)
| Specification | Thickness (mm) | K/W/Inch | Remark |
|---|---|---|---|
| ICT-TC-GFSP-US-4011-50 | 0.50 | 0.290 | |
| ICT-TC-GFSP-US-4011-100 | 1.00 | 0.600 | (?) |
| ICT-TC-GFSP-US-4011-200 | 2.00 | 0.890 | |
| ICT-TC-GFSP-US-4011-300 | 3.00 | 1.200 |
