Thermally Conductive Gap Fillers, Pads, Spacers, Soft-, Ultrasoft-Gel
ICT-TC-GFSP-US-4011
formerly ICT-FSL-BS
Thermally Conductive Spacer ICT-TC-GFSP-US-4011
ICT-TC-GFSP-US-4011 is a ultrasoft, thermally conductive gap-filler-spacer with which very good thermal connections can be realized via large gaps, for example by height differences of electronic components or large tolerances.
The elastomer has a very high elasticity, high dielectric strength and excellent high thermal conductivity, which is achieved due to a first-class and balanced careful selection of proprietary ceramic fillers in conjunction with ceramic powder
The spacer has a compressibility of more than 30%. Due to its very high softness and adaptability, optimum thermal contact is achieved even at very low pressures. As a result, the thermal total transition resistance is reduced to whitish and to a large extent considerably.
The first-class combination of mechanical and thermal properties as well as quality and price completes the portfolio of the ICT-Gapfiller-spacer. This material is suitable for a very wide range of applications. Due to the natural adhesion of the Silikonelastomers, the material can also be affixed very well in advance
Product properties for ICT-TC-GFSP-US-4011(*)
| Thermal Properties | |
|---|---|
| Operating temperature | from -60 to 180 °C |
| Thermally conductive | Yes |
| Thermal conductivity | 3.00 W/m*K |
| Thermal resistance (inch² / 645,16mm²) | 0.290.600.891.20 |
| General Properties | |
| Density | 2.8 g/cm³ |
| Color | Light Blue |
| Electrical Properties | |
| Dielectric breakdown voltage | 10.00 kV/mm |
| Electrically conductive | No |
| Mechanical Properties | |
| Hardeness (Shore 00) | 30.00 Shore 00 |
Variants
| Specification | Thickness (mm) | K/W/Inch2 |
|---|---|---|
| ICT-TC-GFSP-US-4011-50 | 0.50 | 0.290 |
| ICT-TC-GFSP-US-4011-100 | 1.00 | 0.600 |
| ICT-TC-GFSP-US-4011-200 | 2.00 | 0.890 |
| ICT-TC-GFSP-US-4011-300 | 3.00 | 1.200 |
* Subject to change and errors excepted.
