Thermally Conductive Gap Fillers, Pads, Spacers, Soft-, Ultrasoft-Gel
ICT-TC-GFSP-1412
Soft, thermally conductive, electrically insulating 2-layer silicone gap filler pad
The ICT-TC-GFSP-1412 series
is a thermally conductive, electrically insulating gap filler soft pad 2-layer type based on silicone (low volatile siloxane). The top surface has minimal adhesion, whereas the bottom side has excellent natural adhesion. This enables excellent thermal conduction, attributable to the material's softness and its capacity to adapt to different shapes.
The ICT-TC-GFSP-1412 series is guaranteed to offer good thermal conductivity, technical elasticity and high electrical dielectric strength. This material is perfect for a wide range of applications where large gaps between power components and heat sinks need to be bridged.
Product properties for ICT-TC-GFSP-1412(*)
| General Properties | |
|---|---|
| Color | MulticolorOrange-Yellow |
| Material | 2-Layer, Silicone Elastomere Aufbau |
| Density | 1.85 g/cm³ |
| UL flammability rating | UL 94V-0 UL |
| Thermal Properties | |
| Thermal conductivity | 1.50 W/m*K |
| Thermally conductive | Yes |
| Operating temperature | from 40 to 150 °C |
| Electrical Properties | |
| Electrically conductive | No |
| Dielectric breakdown voltage | >10KV/mm kV/mm |
Variants (*)
| Specification | Thickness (mm) | K/W/Inch | Remark |
|---|---|---|---|
| ICT-TC-GFSP-1412-50 | 0.50 | 0.500 | Gemessen von ZFW |
| ICT-TC-GFSP-1412-100 | 1.00 | ||
| ICT-TC-GFSP-1412-150 | 1.50 | ||
| ICT-TC-GFSP-1412-200 | 2.00 | ||
| ICT-TC-GFSP-1412-250 | 2.50 | ||
| ICT-TC-GFSP-1412-300 | 3.00 | ||
| ICT-TC-GFSP-1412-350+ | 3.50 | auf Anfrage bis 8mm |
* Subject to change and errors excepted.
