04 Thermally Conductive Gap Fillers, Pads, Spacers, Soft-, Ultrasoft-Gel
Electrically insulating soft and ultra-soft silicone-based, highly heat-conductive Gapfiller so called Spacer are ideal for applications in which, in addition to thermal conductivity, the compensation of extreme tolerances and gaps is particularly important, especially in non-planar structures without the application of pressure, and electrical insulation.
Thermally Conductive Gap Fillers, Pads, Spacers, Soft-, Ultrasoft-Gel
- ICT-TC-TXE 5.00 W/m*K
- ICT-TC-TXS 5.00 W/m*K
- ICT-TC-GFSP-US-4011 3.00 W/m*K
- ICT-FSL-B 4.00 W/m*K
- ICT-TC-GFSP-S-4002 4.00 W/m*K
- ICT-TC-GFSP-S-4001 3.00 W/m*K
- ICT-TC-GFSP-US-4010 2.00 W/m*K
- ICT-FSL-H 5.00 W/m*K
- ICT-FSL-HR 8.00 W/m*K
- ICT-FSL-K4 2.00 W/m*K
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Thermally Conductive Gap Fillers, Pads, Spacers, Soft-, Ultrasoft-Gel
PRODUCT DESCRIPTION
Highly thermally conductive, soft and ultrasoft, electrically insulating, silicone-based Gap Filler Pads (TC Soft Silicone Gel Pads) are suitable for applications which, aside from thermal conductivity, require the compensation of large gaps and tolerances – especially in the case of non-planar builds without pressure – as well as good electric insulation.
The high elasticity of these products additionally contributes to mechanical dampening within the application. Owing to their thermal properties, these elastomeric films – especially putty materials with low to no
spring-back – are the ideal T.I.M. solution for application with electronic components on SMD circuit boards.
We are able to provide a broad range of excellent and innovative, highly thermoconductive soft elastomers with thermal conductivities ranging from 1.0 to 13 W/mK.
Some variants are equipped with carrier materials such as fibreglass reinforcement, polymer mesh, or surface lamination for added mechanical stability, and/or with one-sided adhesive that affords easy automated montage.
Comparison table
| Property | ICT-TC-TXE | ICT-TC-TXS | ICT-TC-GFSP-US-4011 | ICT-FSL-B | ICT-TC-GFSP-S-4002 | ICT-TC-GFSP-S-4001 | ICT-TC-GFSP-US-4010 | ICT-FSL-H | ICT-FSL-HR | ICT-FSL-K4 |
|---|---|---|---|---|---|---|---|---|---|---|
| Thermische Eigenschaften | ||||||||||
| Operating temperature | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C |
| Thermally conductive | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Thermal conductivity | 5.00 W/m*K | 5.00 W/m*K | 3.00 W/m*K | 4.00 W/m*K | 4.00 W/m*K | 3.00 W/m*K | 2.00 W/m*K | 5.00 W/m*K | 8.00 W/m*K | 2.00 W/m*K |
| Thermal resistance (inch² / 645,16mm²) | 0.270 .. 1.740 K/W | 0.250 .. 1.200 K/W | 0.290 .. 1.2 K/W | - | 0.440 .. 0.3 K/W | 0.2 .. 0.890 K/W | 0.390 .. 2.330 K/W | - | - | - |
| Allgemeine Eigenschaften | ||||||||||
| Density | 3.1 g/cm³ | 3.1 g/cm³ | 2.8 g/cm³ | 2.8 g/cm³ | 2.8 g/cm³ | 2.70 g/cm³ | 1.7 g/cm³ | 3.1 g/cm³ | 3.3 g/cm³ | 2.5 g/cm³ |
| Color | Gray | Gray | Light Blue | Light Blue | Light Blue | Light Blue | Light Gray | Gray | Gray | Light Blue |
| Material | Silicone Softpad Aufbau | Silicone Softpad Aufbau | - | - | - | - | - | - | - | - |
| UL flammability rating | - | - | - | V-0 UL | V-1 UL | - | - | - | - | - |
| Elektrische Eigenschaften | ||||||||||
| Electrically conductive | No | No | No | No | No | No | No | No | No | No |
| Dielectric breakdown voltage | - | >15000 kV/mm | 10.00 kV/mm | 10.00 kV/mm | 10.00 kV/mm | 10.00 kV/mm | 10.00 kV/mm | 10.00 kV/mm | 10.00 kV/mm | 10.00 kV/mm |
| Mechanische Eigenschaften | ||||||||||
| Hardeness (Shore 00) | 50.00 Shore 00 | 88.00 Shore 00 | 30.00 Shore 00 | 56.00 Shore 00 | 62.00 Shore 00 | 73.00 Shore 00 | 38.00 Shore 00 | 76.00 Shore 00 | 76.00 Shore 00 | 42.00 Shore 00 |
| Hardness (Shore A) | 29.00 Shore A | 32.00 Shore A | - | - | - | - | - | - | - | - |
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