04 Thermally Conductive Gap Fillers, Pads, Spacers, Soft-, Ultrasoft-Gel
Electrically insulating soft and ultra-soft silicone-based, highly heat-conductive Gapfiller so called Spacer are ideal for applications in which, in addition to thermal conductivity, the compensation of extreme tolerances and gaps is particularly important, especially in non-planar structures without the application of pressure, and electrical insulation.
Thermally Conductive Gap Fillers, Pads, Spacers, Soft-, Ultrasoft-Gel
- ICT-TC-TXE 5 W/m*K
- ICT-TC-TXS 5 W/m*K
- ICT-TC-GFSP-US-4011 3 W/m*K
- ICT-FSL-B 4 W/m*K
- ICT-TC-GFSP-S-4002 4 W/m*K
- ICT-TC-GFSP-S-4001 3 W/m*K
- ICT-TC-GFSP-US-4010 2 W/m*K
- ICT-FSL-H 5 W/m*K
- ICT-FSL-HR 8 W/m*K
- ICT-FSL-K4 2 W/m*K
- ICT-TC-GFSP-1412 1.5 W/m*K
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Thermally Conductive Gap Fillers, Pads, Spacers, Soft-, Ultrasoft-Gel
PRODUCT DESCRIPTION
Highly thermally conductive, soft and ultrasoft, electrically insulating, silicone-based Gap Filler Pads (TC Soft Silicone Gel Pads) are suitable for applications which, aside from thermal conductivity, require the compensation of large gaps and tolerances – especially in the case of non-planar builds without pressure – as well as good electric insulation.
The high elasticity of these products additionally contributes to mechanical dampening within the application. Owing to their thermal properties, these elastomeric films – especially putty materials with low to no
spring-back – are the ideal T.I.M. solution for application with electronic components on SMD circuit boards.
We are able to provide a broad range of excellent and innovative, highly thermoconductive soft elastomers with thermal conductivities ranging from 1.0 to 13 W/mK.
Some variants are equipped with carrier materials such as fibreglass reinforcement, polymer mesh, or surface lamination for added mechanical stability, and/or with one-sided adhesive that affords easy automated montage.
Comparison table
| Property | ICT-TC-TXE | ICT-TC-TXS | ICT-TC-GFSP-US-4011 | ICT-FSL-B | ICT-TC-GFSP-S-4002 | ICT-TC-GFSP-S-4001 | ICT-TC-GFSP-US-4010 | ICT-FSL-H | ICT-FSL-HR | ICT-FSL-K4 | ICT-TC-GFSP-1412 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Thermal Properties | |||||||||||
| Operating temperature | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C | from -60 to 180 °C | from 40 to 150 °C |
| Thermally conductive | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Thermal conductivity | 5 W/m*K | 5 W/m*K | 3 W/m*K | 4 W/m*K | 4 W/m*K | 3 W/m*K | 2 W/m*K | 5 W/m*K | 8 W/m*K | 2 W/m*K | 1.5 W/m*K |
| Thermal resistance (inch² / 645,16mm²) | 0.270 .. 1.740 K/W | 0.250 .. 1.200 K/W | 0.290 .. 1.2 K/W | - | 0.440 .. 0.3 K/W | 0.2 .. 0.890 K/W | 0.390 .. 2.330 K/W | - | - | - | - |
| General Properties | |||||||||||
| Density | 3.1 g/cm³ | 3.1 g/cm³ | 2.8 g/cm³ | 2.8 g/cm³ | 2.8 g/cm³ | 2.7 g/cm³ | 1.7 g/cm³ | 3.1 g/cm³ | 3.3 g/cm³ | 2.5 g/cm³ | 1.9 g/cm³ |
| Color | Gray | 0.5 | 1 | 2 | 3 | Light Blue | Light Blue | Light Blue | Light Blue | Light Gray | Gray | Gray | Light Blue | Multicolor | Orange-Yellow |
| Material | Silicone Softpad Aufbau | Silicone Softpad Aufbau | - | - | - | - | - | - | - | - | 2-Layer, Silicone Elastomere Aufbau |
| Flammability (UL 94) | - | - | - | V-0 | V-1 | - | - | - | - | - | UL 94V-0 |
| Electrical Properties | |||||||||||
| Electrically conductive | No | No | No | No | No | No | No | No | No | No | No |
| Dielectric breakdown voltage | - | > > 15000 kV/mm | 10.00 kV/mm | 10.00 kV/mm | 10.00 kV/mm | 10.00 kV/mm | 10.00 kV/mm | 10.00 kV/mm | 10.00 kV/mm | 10.00 kV/mm | > >10KV/mm kV/mm |
| Mechanical Properties | |||||||||||
| Hardness (Shore 00) | 50 | 88 | 30 | 56 | 62 | 73 | 38 | 76 | 76 | 42 | - |
| Hardness (Shore A) | 29 Shore A | 32 Shore A | - | - | - | - | - | - | - | - | - |
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