PRODUCT PROPERTIES

• Thermal conductivity from 1.0 TO 5.0 W/mK
• Thermal resistivity <0,55 °C-inch2/W possible
• Very high dielectric strength (>8 kV/mm AC)
• Material gauges from 0.25 to 3.00 mm (other gauges
  available upon request)
• Soft and highly adaptable, very good mechanical dampening properties
• Effective at very low or zero pressure
• High temperature resistance and reliability (-40°C to 125/150°C)
• Silicone-free and no oil bleeding

PROPERTIES AND ADVANTAGES AT A GLANCE

• Process-safe handling/pre-application
• Easy montage due to natural auto-adhesion
• Some variants low outgassing
• Excellent mechanical dampening properties
• Very process-safe due to even material thickness
• Extraordinary elasticity and flexibility
• Low hardness (Shore 40 – 85), i.e. very soft

PRODUCT VARIANTS

• Acrylic / acrylate resin-based with ceramic filler
• Hard adhesive surface if laminated, or compressible/soft
• Different hardness degrees available (Shore 00 ¬ 40 –85)
• Unreinforced or reinforced (PET mesh or PI lamination)
• Some variants very low outgassing
• Very thin material gauges possible (0.25 – 0.30 mm)
• Non-flammable (UL 94 VO) for some variants

DELIVERY FORMS AND VARIANTS

• In sheets or on rolls (thickness < 0.50 mm) upon request for special cuts
• Auto-adhesive on one or both sides or laminated on one side
• Loose bulk, special kiss-cut formats on sheet
• Equipped with release lining on both sides (PET film)
• Other customer-specific delivery formats/cuts
  (in bulk or on carrier lining, also kiss-cut) available upon request

TYPICAL AREAS OF APPLICATION

Silicone-free, acrylic-based Gap Filler Pads for electric insulation and thermal linkage of heat source to heat sink are used in:

• LED modules; discrete semiconductor MOSFETs; connections to
  casings or coolers; electrolytic capacitors, storage batteries etc.

Applications e.g.:

• Battery storage systems; robotics; UPS; displays
• CPU modules; LEDs; automotive applications; white goods etc.