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Thermally Conductive Gap Fillers, Pads, Spacers, Soft-, Ultrasoft-Gel
ICT-FSL-B
Thermally Conductive Spacer ICT-FSL-B
Fact Sheet
ICT-FSL-B is the entry-level model of the thermally conductive, electrically insulating gap filler spacers based on silicone. The elastomer has an excellent balance between thermal conductivity and thermal transfer resistance.
In addition to a very high thermal conductivity, the elastomer, which is enriched in the special manufacturing process with heat-conducting ceramics, also has excellent technical elasticity and a very high electrical impact resistance.
ICT-FSL-B offers very good thermal performance. The gap filler spacer significantly reduces the overall transition resistance and provides an optimal thermal path, a very good thermal performance. The first-class combination of thermal and mechanical properties makes the material suitable for a wide range of applications; Wherever large gaps must be bridged from the power component to the heat sink.
ICT-FSL-B has very high reliability. Due to its natural adhesion, the material can also be easily pre-affixed
Product properties for ICT-FSL-B(*)
| Property | Value | Test Method |
|---|---|---|
| Thermal Properties | ||
| Operating temperature | from -60 to 180 °C | OEM/ICT |
| Thermally conductive | Yes | OEM/ICT |
| Thermal conductivity | 4 W/m*K | ASTM D 5470 |
| General Properties | ||
| Density | 2.8 g/cm³ | ASTM D 792 |
| Flammability (UL 94) | V-0 | UL 94 |
| Color | Light Blue | Visual |
| Electrical Properties | ||
| Dielectric breakdown voltage | 10.00 kV/mm | ASTM D 149 |
| Electrically conductive | No | OEM/ICT |
| Mechanical Properties | ||
| Hardness (Shore 00) | 56 | ASTM D 2240 |
* Subject to change and errors excepted.
