Thermally Conductive Gap Fillers, Pads, Spacers, Soft-, Ultrasoft-Gel
ICT-FSL-B
Thermally Conductive Spacer ICT-FSL-B
ICT-FSL-B is the entry-level model of the thermally conductive, electrically insulating gap filler spacers based on silicone. The elastomer has an excellent balance between thermal conductivity and thermal transfer resistance.
In addition to a very high thermal conductivity, the elastomer, which is enriched in the special manufacturing process with heat-conducting ceramics, also has excellent technical elasticity and a very high electrical impact resistance.
ICT-FSL-B offers very good thermal performance. The gap filler spacer significantly reduces the overall transition resistance and provides an optimal thermal path, a very good thermal performance. The first-class combination of thermal and mechanical properties makes the material suitable for a wide range of applications; Wherever large gaps must be bridged from the power component to the heat sink.
ICT-FSL-B has very high reliability. Due to its natural adhesion, the material can also be easily pre-affixed
Product properties for ICT-FSL-B(*)
| Thermal Properties | |
|---|---|
| Operating temperature | from -60 to 180 °C |
| Thermally conductive | Yes |
| Thermal conductivity | 4.00 W/m*K |
| General Properties | |
| Density | 2.8 g/cm³ |
| UL flammability rating | V-0 UL |
| Color | Light Blue |
| Electrical Properties | |
| Dielectric breakdown voltage | 10.00 kV/mm |
| Electrically conductive | No |
| Mechanical Properties | |
| Hardeness (Shore 00) | 56.00 Shore 00 |
* Subject to change and errors excepted.
