ICT-FSL-HR
Thermally Conductive Spacer ICT-FSL-HR
In addition to a very high thermal conductivity, the elastomer, which is enriched in the special manufacturing process with heat-conducting ceramics, also has excellent technical elasticity and a very high electrical impact resistance.
ICT-FSL-HR offers excellent thermal performance. The gap filler spacer significantly reduces the overall transfer resistance and provides an optimal thermal path-for a very good thermal performance. The first-class combination of very high thermal and mechanical properties makes the material suitable for a wide range of applications; Wherever large gaps must be bridged from the power component to the heat sink.
Product properties for ICT-FSL-HR(*)
| Thermal Properties | |
|---|---|
| Operating temperature | 0 °C |
| Thermally conductive | No |
| Thermal conductivity | 0.00 W/m*K |
| General Properties | |
| Density | 3.3 g/cm³ |
| Color | Gray |
| Electrical Properties | |
| Dielectric breakdown voltage | 10.00 kV/mm |
| Electrically conductive | No |
| Mechanical Properties | |
| Hardness (Shore 00) | 0.00 Shore 00 |
* Subject to change and errors excepted.
