ICT-FSL-HR
Thermally Conductive Spacer ICT-FSL-HR
Fact Sheet
In addition to a very high thermal conductivity, the elastomer, which is enriched in the special manufacturing process with heat-conducting ceramics, also has excellent technical elasticity and a very high electrical impact resistance.
ICT-FSL-HR offers excellent thermal performance. The gap filler spacer significantly reduces the overall transfer resistance and provides an optimal thermal path-for a very good thermal performance. The first-class combination of very high thermal and mechanical properties makes the material suitable for a wide range of applications; Wherever large gaps must be bridged from the power component to the heat sink.
Product properties for ICT-FSL-HR(*)
| Property | Value | Test Method |
|---|---|---|
| Thermal Properties | ||
| Operating temperature | from -60 to 180 °C | OEM/ICT |
| Thermally conductive | Yes | OEM/ICT |
| Thermal conductivity | 8 W/m*K | ASTM D 5470 |
| General Properties | ||
| Density | 3.3 g/cm³ | ASTM D 792 |
| Color | Gray | Visual |
| Electrical Properties | ||
| Dielectric breakdown voltage | 10.00 kV/mm | ASTM D 149 |
| Electrically conductive | No | OEM/ICT |
| Mechanical Properties | ||
| Hardness (Shore 00) | 76 | ASTM D 2240 |
* Subject to change and errors excepted.
