Thermally Conductive Gap Fillers, Pads, Spacers, Soft-, Ultrasoft-Gel
ICT-TC-GFSP-S-4001
formerly ICT-FSL-D
Thermally Conductive Spacer ICT-TC-GFSP-S-4001
ICT-TC-GFSP-S-4001 is a thermally conductive, electrically insulating gap-filler-spacer based on silicone, with which very good thermal connections can be realized due to its softness and adaptability. In addition to a high thermal conductivity, the elastomer enriched in the special manufacturing process with heat conducting ceramics has excellent technical elasticity and high electrical impact resistance.
ICT-TC-GFSP-S-4001 significantly reduces the overall transfer resistance and provides an optimal thermal path-a very good thermal performance. The first-class combination of thermal and mechanical properties makes the material suitable for a wide range of applications; Wherever large gaps must be bridged from the power component to the heat sink.
ICT-TC-GFSP-S-4001 contains less low molecular siloxane and is characterized by very high reliability. In addition, it offers a balance in terms of best material performance by price & quality.
Due to its natural adhesion, the material can also be affixed very well in advance. The gap-filler-spacer is unilaterally available on both sides and self-adhesive.
Product properties for ICT-TC-GFSP-S-4001(*)
| Thermal Properties | |
|---|---|
| Operating temperature | from -60 to 180 °C |
| Thermally conductive | Yes |
| Thermal conductivity | 3.00 W/m*K |
| Thermal resistance (inch² / 645,16mm²) | 0.200.490.89 |
| General Properties | |
| Density | 2.70 g/cm³ |
| Color | Light Blue |
| Electrical Properties | |
| Dielectric breakdown voltage | 10.00 kV/mm |
| Electrically conductive | No |
| Mechanical Properties | |
| Hardeness (Shore 00) | 73.00 Shore 00 |
Variants
| Specification | Thickness (mm) | K/W/Inch2 |
|---|---|---|
| ICT-TC-GFSP-S-4001-50 | 0.50 | 0.200 |
| ICT-TC-GFSP-S-4001-100 | 1.00 | 0.490 |
| ICT-TC-GFSP-S-4001-200 | 2.00 | 0.890 |
* Subject to change and errors excepted.
