ICT-TC-GFSP-S-4001
formerly ICT-FSL-D
Thermally Conductive Spacer ICT-TC-GFSP-S-4001
ICT-TC-GFSP-S-4001 is a thermally conductive, electrically insulating gap-filler-spacer based on silicone, with which very good thermal connections can be realized due to its softness and adaptability. In addition to a high thermal conductivity, the elastomer enriched in the special manufacturing process with heat conducting ceramics has excellent technical elasticity and high electrical impact resistance.
Product properties for ICT-TC-GFSP-S-4001(*)
| Property | Value | Test Method |
|---|---|---|
| Thermal Properties | ||
| Operating temperature | from -60 to 180 °C | OEM/ICT |
| Thermally conductive | Yes | OEM/ICT |
| Thermal conductivity | 3 W/m*K | ASTM D 5470 |
| Thermal resistance (inch² / 645,16mm²) | 0.20.490.89 | OEM/ICT |
| General Properties | ||
| Density | 2.7 g/cm³ | ASTM D 792 |
| Color | Light Blue | Visual |
| Electrical Properties | ||
| Dielectric breakdown voltage | 10.00 kV/mm | ASTM D 149 |
| Electrically conductive | No | OEM/ICT |
| Mechanical Properties | ||
| Hardness (Shore 00) | 73 | ASTM D 2240 |
Variants (*)
| Specification | Thickness (mm) | K/W/Inch |
|---|---|---|
| ICT-TC-GFSP-S-4001-50 | 0.50 | 0.200 |
| ICT-TC-GFSP-S-4001-100 | 1.00 | 0.490 |
| ICT-TC-GFSP-S-4001-200 | 2.00 | 0.890 |
