ICT-TC-GFSP-S-4001

formerly ICT-FSL-D

Thermally Conductive Spacer ICT-TC-GFSP-S-4001

Fact Sheet

ICT-TC-GFSP-S-4001 is a thermally conductive, electrically insulating gap-filler-spacer based on silicone, with which very good thermal connections can be realized due to its softness and adaptability. In addition to a high thermal conductivity, the elastomer enriched in the special manufacturing process with heat conducting ceramics has excellent technical elasticity and high electrical impact resistance.


ICT-TC-GFSP-S-4001 significantly reduces the overall transfer resistance and provides an optimal thermal path-a very good thermal performance. The first-class combination of thermal and mechanical properties makes the material suitable for a wide range of applications; Wherever large gaps must be bridged from the power component to the heat sink.

ICT-TC-GFSP-S-4001 contains less low molecular siloxane and is characterized by very high reliability. In addition, it offers a balance in terms of best material performance by price & quality.

Due to its natural adhesion, the material can also be affixed very well in advance. The gap-filler-spacer is unilaterally available on both sides and self-adhesive.

Product properties for ICT-TC-GFSP-S-4001(*)

Property Value Test Method
Thermal Properties
Operating temperature from -60 to 180 °C OEM/ICT
Thermally conductive Yes OEM/ICT
Thermal conductivity 3 W/m*K ASTM D 5470
Thermal resistance (inch² / 645,16mm²) 0.20.490.89 OEM/ICT
General Properties
Density 2.7 g/cm³ ASTM D 792
Color Light Blue Visual
Electrical Properties
Dielectric breakdown voltage 10.00 kV/mm ASTM D 149
Electrically conductive No OEM/ICT
Mechanical Properties
Hardness (Shore 00) 73 ASTM D 2240

Variants (*)

Specification Thickness (mm) K/W/Inch
ICT-TC-GFSP-S-4001-50 0.50 0.200
ICT-TC-GFSP-S-4001-100 1.00 0.490
ICT-TC-GFSP-S-4001-200 2.00 0.890
* Subject to change and errors excepted.