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Thermally Conductive Gap Fillers, Pads, Spacers, Soft-, Ultrasoft-Gel
ICT-FSL-H
Thermally Conductive Spacer ICT-FSL-H
Fact Sheet
ICT-FSL-H is in the top place of the FSL lineup, this gap-filler-spacer has a very high thermal conductivity of 5 W/mK and, due to its mechanical properties, achieves a Rth of 0.42 C °/W (1mm) and thus an excellent overall transition resistance.
ICT-FSL-H is a successful combination of very good thermal and mechanical properties and results in an optimal thermal path-an excellent thermal performance.
ICT-FSL-H contains low molecular siloxane in the lower area and is characterized by very high reliability. This product also offers the user a balanced relationship in terms of best material performance in price and quality. The Gapfiller-spacer is suitable for a wide range of applications where larger gaps must be efficiently bridged from the power component to the heat sink.
Product properties for ICT-FSL-H(*)
| Property | Value | Test Method |
|---|---|---|
| Thermal Properties | ||
| Operating temperature | from -60 to 180 °C | OEM/ICT |
| Thermally conductive | Yes | OEM/ICT |
| Thermal conductivity | 5 W/m*K | ASTM D 5470 |
| General Properties | ||
| Density | 3.1 g/cm³ | ASTM D 792 |
| Color | Gray | Visual |
| Electrical Properties | ||
| Dielectric breakdown voltage | 10.00 kV/mm | ASTM D 149 |
| Electrically conductive | No | OEM/ICT |
| Mechanical Properties | ||
| Hardness (Shore 00) | 76 | ASTM D 2240 |
* Subject to change and errors excepted.
