Thermally Conductive Gap Fillers, Pads, Spacers, Soft-, Ultrasoft-Gel
ICT-FSL-H
Thermally Conductive Spacer ICT-FSL-H
ICT-FSL-H is in the top place of the FSL lineup, this gap-filler-spacer has a very high thermal conductivity of 5 W/mK and, due to its mechanical properties, achieves a Rth of 0.42 C °/W (1mm) and thus an excellent overall transition resistance.
ICT-FSL-H is a successful combination of very good thermal and mechanical properties and results in an optimal thermal path-an excellent thermal performance.
ICT-FSL-H contains low molecular siloxane in the lower area and is characterized by very high reliability. This product also offers the user a balanced relationship in terms of best material performance in price and quality. The Gapfiller-spacer is suitable for a wide range of applications where larger gaps must be efficiently bridged from the power component to the heat sink.
Product properties for ICT-FSL-H(*)
| Thermal Properties | |
|---|---|
| Operating temperature | from -60 to 180 °C |
| Thermally conductive | Yes |
| Thermal conductivity | 5.00 W/m*K |
| General Properties | |
| Density | 3.1 g/cm³ |
| Color | Gray |
| Electrical Properties | |
| Dielectric breakdown voltage | 10.00 kV/mm |
| Electrically conductive | No |
| Mechanical Properties | |
| Hardeness (Shore 00) | 76.00 Shore 00 |
* Subject to change and errors excepted.
