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Thermally Conductive Gap Fillers, Pads, Spacers, Soft-, Ultrasoft-Gel
ICT-FSL-K4
Thermally Conductive Spacer FSL-HM
Fact Sheet
ICT-FSL-K4 is currently still in the final phase of prototype status.
In the near future, in addition to the FSL-F3 and the FSL-D gap filler spacer, which has already been very successfully placed on the market another best product performer in price and quality will be available to the user.
Product properties for ICT-FSL-K4(*)
| Property | Value | Test Method |
|---|---|---|
| Thermal Properties | ||
| Operating temperature | from -60 to 180 °C | OEM/ICT |
| Thermally conductive | Yes | OEM/ICT |
| Thermal conductivity | 2 W/m*K | ASTM D 5470 |
| General Properties | ||
| Density | 2.5 g/cm³ | ASTM D 792 |
| Color | Light Blue | Visual |
| Electrical Properties | ||
| Dielectric breakdown voltage | 10.00 kV/mm | ASTM D 149 |
| Electrically conductive | No | OEM/ICT |
| Mechanical Properties | ||
| Hardness (Shore 00) | 42 | ASTM D 2240 |
* Subject to change and errors excepted.
