ICT-FSL-K4

Thermally Conductive Spacer FSL-HM

ICT-FSL-K4 is currently still in the final phase of prototype status.
In the near future, in addition to the FSL-F3 and the FSL-D gap filler spacer, which has already been very successfully placed on the market another best product performer in price and quality will be available to the user. 

Product properties for ICT-FSL-K4(*)

Thermal Properties
Operating temperature from -60 to 180 °C
Thermally conductive Yes
Thermal conductivity 2.00 W/m*K
General Properties
Density 2.5 g/cm³
Color Light Blue
Electrical Properties
Dielectric breakdown voltage 10.00 kV/mm
Electrically conductive No
Mechanical Properties
Hardeness (Shore 00) 42.00 Shore 00
* Subject to change and errors excepted.