ICT-TC-GFP-US-4030

SIlicone-based Ultrasoft gap-filler, laminated with insulating PET layer

ICT-TC-TC-GFP-US-430 is a thermally conductive, electrically insulating silicone-based gap filler spacer combined with an electrically highly insulating polyester layer applied to one side. This material variant guarantees a very good thermal connection due to its softness and conformability. The silicone elastomer laminate, which is enriched with thermally conductive ceramic in a special manufacturing process, has excellent technical elasticity and very high dielectric strength in addition to high thermal conductivity. 

ICT-TC-TC-GFP-US-430 reduces the thermal resistance and ensures very good thermal performance. The excellent combination of thermal and mechanical properties makes the material suitable for a wide range of applications, wherever large gaps need to be bridged from the power component to the heat sink. The additional laminated polyester surface also guarantees high dielectric strength (>600 V/UL CTI Group 1)

Product properties for ICT-TC-GFP-US-4030(*)

General Properties
Color BlauGelbMulticolor
Material Lamination Silicon; Polyester Aufbau
Density 2.98 g/cm³
UL flammability rating UL94V-0 UL
Thermal Properties
Thermal conductivity 1.94 W/m*K
Thermal resistance (inch² / 645,16mm²) 0.964 K/W
Operating temperature from 40 to 200 °C
Electrical Properties
Electrically conductive No
Dielectric breakdown voltage > 10 kV/mm

Variants (*)

Specification Thickness (mm) K/W/Inch Remark
ICT-TC-GFP-US-430-50 0.50
ICT-TC-GFP-US-430-100 1.00 64.000 (Bei 7N)
ICT-TC-GFP-US-430-150 1.50
ICT-TC-GFP-US-430-200 2.00 53.700 (Bei 7N); Glatt
ICT-TC-GFP-US-430-300 3.00 Rau
ICT-TC-GFP-US-430-400 4.00
ICT-TC-GFP-US-430-500 5.00
ICT-TC-GFP-US-430-600 6.00
ICT-TC-GFP-US-430-700 7.00
ICT-TC-GFP-US-430-800 8.00
ICT-TC-GFP-US-430-900 9.00
ICT-TC-GFP-US-430-1000 10.00
* Subject to change and errors excepted.