ICT-TC-GFP-US-4030
SIlicone-based Ultrasoft gap-filler, laminated with insulating PET layer
ICT-TC-TC-GFP-US-430 is a thermally conductive, electrically insulating silicone-based gap filler spacer combined with an electrically highly insulating polyester layer applied to one side. This material variant guarantees a very good thermal connection due to its softness and conformability. The silicone elastomer laminate, which is enriched with thermally conductive ceramic in a special manufacturing process, has excellent technical elasticity and very high dielectric strength in addition to high thermal conductivity.
ICT-TC-TC-GFP-US-430 reduces the thermal resistance and ensures very good thermal performance. The excellent combination of thermal and mechanical properties makes the material suitable for a wide range of applications, wherever large gaps need to be bridged from the power component to the heat sink. The additional laminated polyester surface also guarantees high dielectric strength (>600 V/UL CTI Group 1)
Product properties for ICT-TC-GFP-US-4030(*)
General Properties | |
---|---|
Color | BlauGelbMulticolor |
Material | Lamination Silicon; Polyester Aufbau |
Density | 2.98 g/cm³ |
UL flammability rating | UL94V-0 UL |
Thermal Properties | |
Thermal conductivity | 1.94 W/m*K |
Thermal resistance (inch² / 645,16mm²) | 0.964 K/W |
Operating temperature | from 40 to 200 °C |
Electrical Properties | |
Electrically conductive | No |
Dielectric breakdown voltage | > 10 kV/mm |
Variants (*)
Specification | Thickness (mm) | K/W/Inch | Remark |
---|---|---|---|
ICT-TC-GFP-US-430-50 | 0.50 | ||
ICT-TC-GFP-US-430-100 | 1.00 | 64.000 | (Bei 7N) |
ICT-TC-GFP-US-430-150 | 1.50 | ||
ICT-TC-GFP-US-430-200 | 2.00 | 53.700 | (Bei 7N); Glatt |
ICT-TC-GFP-US-430-300 | 3.00 | Rau | |
ICT-TC-GFP-US-430-400 | 4.00 | ||
ICT-TC-GFP-US-430-500 | 5.00 | ||
ICT-TC-GFP-US-430-600 | 6.00 | ||
ICT-TC-GFP-US-430-700 | 7.00 | ||
ICT-TC-GFP-US-430-800 | 8.00 | ||
ICT-TC-GFP-US-430-900 | 9.00 | ||
ICT-TC-GFP-US-430-1000 | 10.00 |