ICT-Xp45

Phase-Change-Material ICT-Xp45-W-SERIES (without substrate liner)

The ICT-Xp45-W-series is cost-efficient, electrically non-insulating and enriched with a high-heat conductive filler, solvent-and silicone-free high-performance phase change material.

The ICT-Xp45-W-series can also be manufactured in a number of different material thicknesses in successive and technically mature production steps.

The product group comprises three thickness units in total:

  1. ICT-Xp45-W-10 [0.10 mm]
  2. ICT-Xp45-W-20 [0.20 mm]
  3. ICT-Xp45-W-30 [0.30 mm]

All three products differ only by layer thickness.


An efficient thermal connection to the contact surfaces is only possible, however, by attaching the absolutely uniform coating of the ICT-CONSIDERATIONS45 phase change material. Through the development of this new and unique formulation, the interface is already providing a very efficient thermal transmission by phase change at normal operating temperatures, where a uniform connection line is maintained during the expansion process. With the result that air is efficiently expelled to the outside and any surface irregularities or flatness conditions-which are present across the interface-can be minimised.

With this new and innovative thermal interface solution, IGBT power modules, discrete semiconductors, LEDs, microprocessors or any other type of heat generation can be successfully deheated. With the different available material thicknesses it is also possible to cover a wide range of insulated power supplies. Only through efficient and reliable contact connection between heat generation and heat sink can an optimal thermal be carried out in the heatsink or the housing tray.

Product properties for ICT-Xp45(*)

Thermal Properties
Operating temperature from -40 to 140 °C
Thermally conductive Yes
Thermal conductivity 3.50 W/m*K
Thermal resistance (TO-3P / ca. 360mm²) 1.67 °C/W
Thermal resistance (inch² / 645,16mm²) 0.010.010.02
Electrical Properties
Electrically conductive Yes
General Properties
Color Gray
Material Pure film | Compound Aufbau

Variants

Specification Thickness (mm) K/W/Inch2
ICT-Xp45-W-10 0.10 0.014
ICT-Xp45-W-20 0.20 0.015
ICT-Xp45-W-30 0.30 0.016
* Subject to change and errors excepted.