ICT-PC-Fillup-STICK

ICT-PCM-LINE UP pure Compounds|electrically non-insulating TIM products (pure interface material)

The ICT-PC-fillup-stick is the efficient and straightforward solution when it comes to the manual, fast and clean attaching of interface to the thermal interfaces of the semiconductor and heat sink. The PC-FillUp-Stick is ideal for use on a small surface with moderate surface quality or slight roughness of the contact surfaces, for example, often in extrusion profiles and other heat sinks-which are used for connection to CPUs, IGBTs (in to format), as well as other discrete semiconductors, LEDs, and microprocessors-or any other type of heat generation is the case.

The individual work steps are simple;

– Clean contact surfaces - remove protective cap – move the Phase-Change  Compound  – Apply slightly opaque –Cap back on it - finished.

In the so-called fill-up process, the stick is pulled over the two surfaces with a little pressure. The unevenness and roughness on the surface then provide sufficient abrasion. The film thus applied ensures a simple and clean connection of the two surfaces to be contacted.

The ICT FillUp sticks are ideal for small production lots as well as for smaller surfaces and service use.

The materials leave the fixed aggregate state when the phase change temperatures are exceeded from approx. 51°C (ICT-F-ST-IP-bar-graphite fiber) up to 60° (ICT-F-ST-AP-Bar-stan) and become soft. Due to the volumetric expansion above the phase change temperature by approx. 15% to 20%, air pockets are efficiently expelled to the outside. Due to the full-surface wetting, the thermal connection is far superior to the conventional variants and the resulting thermal resistance is significantly lower.