Phase Change Materials (electrically conductive)
ICT SUEDWERK's thermal Interface materials – electrically non-isolating – heat conducting phase change materials as very thin films/films and compounds are ideal for applications where a greatly reduced contact resistance is required between the metal surfaces of the power semiconductor and the heatsink.
Phase Change Materials (electrically conductive)
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Phase Change Materials (electrically conductive)
The increase in the complexity of technical devices, modules or even individual components is the focus of the aspects of reliability, durability and thus the costs of exchange and revision work. Especially in the focus here is of course the power density in power electronic components which has steadily been increasing for years; A direct and decisive influence on the entire service life of semiconductor components is therefore more than ever the effective cooling, because the heat flux as a measure for the dissipated heat per area unit is usually the critical value at the macro level and responsible for the resilience of the application.
In fact, materials are often used for this, which do not always correspond to the application and do not always meet the increasing requirements. So-called phase changing heat conducting interface materials offer the optimal solution here. These thin film coating-based metal substrate carriers are ideally suited for the cooling of power semiconductors in modular design and high-power LEDs.
Of pure interface materials is usually spoken whenever substrate layer thicknesses of less than 0.20 mm can be used in the application.
ICT SUEDWERK's heat-conducting phase-change materials wetting the unavoidable surface roughnesss during softness above the phase change temperature, and expel air pockets from the micro pores of the surface. Due to the fact that type-dependent phase change materials extend with increasing temperature volumetric, the wetting of the contact surfaces is additionally improved.
Due to the liquefaction and expansion as well as the capillary effect, so-called air pockets between the thermally contacting interface are expelled or pressed out. The first overrun of the phase change temperature is sufficient and a permanent thermal contact is established, which is then kept constant over and under the phase change temperature. Due to the full-surface wetting, the thermal connection to the conventional is therefore superior to variants and the resulting thermal resistance is significantly lower. The different phase change materials can also be ordered in several different variants:
- As standard variant aluminium and copper substrate carrier in phase change coating
- As a phase change variant with graphite particles/fibres, which is electrically conductive and also reduces the thermal transition resistance
- As a pure phase change Compoundfilm which is offset by high heat conductive particles and thus a thermal conductivity of up to 3.5 W/mK is achieved
- As a pure compound in cartridge or block format or as a so-called fill-up stick (dispenser)
Phase-Change How does this process work?
When the temperature approaches the defined phase change point, the material changes its aggregate state and passes from the solid, dry to the soft to liquid state. Unavoidable surface roughness are balanced, air pockets are expelled from the micro pores of the surface. In addition, the fact that phase change materials expand volumetric when the temperature increases, the wetting of the contact surfaces is additionally improved. Convex and concave unevenness of the contact surfaces and tolerances can thus be mastered very well.
Comparison table
| Property | ICT-Ap60 | ICT-PC-Fillup-STICK | ICT-Ip50/60 | ICT-Xp45 |
|---|---|---|---|---|
| Thermische Eigenschaften | ||||
| Operating temperature | from -40 to 140 °C | from -60 to 140 °C | from -40 to 140 °C | from -40 to 140 °C |
| Thermally conductive | Yes | No | Yes | Yes |
| Thermal conductivity | 220.00 W/m*K | 0.01 W/m*K | 220.00 W/m*K | 3.50 W/m*K |
| Thermal resistance (inch² / 645,16mm²) | 0.052 .. 0.060 K/W | 0.008 .. 0.020 K/W | 0.009 .. 0.012 K/W | 0.014 .. 0.016 K/W |
| Thermal resistance (TO-3P / ca. 360mm²) | - | - | - | 1.67 °C/W |
| Elektrische Eigenschaften | ||||
| Electrically conductive | Yes | Yes | Yes | Yes |
| Allgemeine Eigenschaften | ||||
| Color | White | White|Graphite | Black | Gray |
| Material | - | PCM Interface compound Aufbau | - | Pure film | Compound Aufbau |
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