ICT-Ap60
Phase-Change-Material ICT-Ap60
ICT-Ap60 can also be produced by several consecutive, innovative and technically mature production steps in different material thicknesses (ICT-Ap60-L10-Al2-H) and with the inclusion of other other aluminium substrate thicknesses.
With this thermal interface solution, for example, IGBT power modules, discrete semiconductors, LEDs, microprocessors or any other type of heat generation can be successfully deheated. With the different available material thicknesses it is also possible to cover a wide range of isolated power supplies. Only through efficient and reliable contact connection between heat generation and heat sink can an optimal thermal be carried out in the heat sink or the housing tray.
Product properties for ICT-Ap60(*)
Thermal Properties | |
---|---|
Operating temperature | from -40 to 140 °C |
Thermally conductive | Yes |
Thermal conductivity | 220.00 W/m*K |
Thermal resistance (inch² / 645,16mm²) | 0.050.06 |
Electrical Properties | |
Electrically conductive | Yes |
General Properties | |
Color | White |