The product group is divided into:
- ICT-Ip50 (temperature phase Change 50 °c) * and Ip60 (temperature phase change 60 °c)
and includes three total units:
ICT-IP50 (60)-G05-AL2 | ICT-IP50 (60)-G06-AL2 | ICT-IP50 (60)-G13-AL2
All three products differ only by the different 2-fold or 4-ply layer thickness.
An efficient, thermal connection to the contact surfaces is only possible by the intake of an absolutely uniform coating of the phase change material on both sides of the subtrate liner.
Through the development of this unique formulation, the interface is already providing a very efficient thermal transmission by phase change at normal operating temperatures, where a uniform connection line is maintained during the expansion process. During the temperature stroke, the air trapped in the surface is efficiently expelled to the outside; With the result that any surface irregularities or flatness conditions that are present beyond the interface can be minimised.
ICT-IP 50 and 60 * can also be produced by several consecutive and technically mature production steps in different material thickness ICT-Ip50 (60)-G05-AL2 | ICT-IP50 (60)-G06-AL2 | ICT-IP50 (60)-G13-AL2 and with the inclusion of other other aluminium substrate carrier thicknesses.
With this thermal interface solution, IGBT power modules, discrete semiconductors, LEDs, microprocessors or any other type of heat generation can be successfully deheated.
With the different available material thicknesses it is also possible to cover a wide range of insulated power supplies. Only through efficient and reliable contact connection between heat generation and heat sink can therefore also be an optimal thermal in the heatsink or the housing tray.