ICT-TC-GFSP-SF-5011

Silicone-free TPE thermal pad with 3.0 W/mK conductivity, excellent electrical insulation, low outgassing, soft and compressible.

Fact Sheet

The ICT-TC-GFSP-SF-5011 Series is composed of a silicone-free, resin-based thermoplastic elastomer (TPE), offering a thermal conductivity of 3.00 W/mK while maintaining excellent heat resistance and electrical insulation properties. The material shows low molecular siloxane volatilization and low total volatile gas, ensuring no electrical contact issues or contamination risks.

The ICT-TC-GFSP-SF-5011 Series is characterized by very good thermal conductivity combined with outstanding electrical insulation, enabled by advanced composite material technologies.

The ICT-TC-GFSP-SF-5011 Series is soft and flexible, with good springback behavior. Its low hardness ensures good compressibility, while its stress relaxation properties, low specific weight, and very good price-performance ratio make this material stand out.

The ICT-TC-GFSP-SF-5011 Series is available in material thicknesses from 0.5 to 10.0 mm. Additional thicknesses are available upon request.

Product properties for ICT-TC-GFSP-SF-5011(*)

Property Value Test Method
General Properties
Color Red Visual
Density 2.6 g/cm³ ASTM D 792
Thermal Properties
Thermal conductivity 3 W/m*K ASTM D 5470
Thermal impedance @ 20 psi ≤ 0.543 C°-in²/W ASTM D 45470
Electrical Properties
Volume resistivity > 1,00 × 10¹¹ Ω/m ASTM D 257
Dielectric breakdown voltage 16 kV/mm ASTM D 149
Mechanical Properties
Hardness (Shore 00) 60 ASTM D 2240
Compressibility @ 20psi 42 % ASTM D 45470 mod.

Variants (*)

Specification Thickness (mm)
ICT-TC-GFSP-SF-5011-50 0.50
ICT-TC-GFSP-SF-5011-100 1.00
ICT-TC-GFSP-SF-5011-150 1.50
ICT-TC-GFSP-SF-5011-200 2.00
ICT-TC-GFSP-SF-5011-250 2.50
ICT-TC-GFSP-SF-5011-300 3.00
ICT-TC-GFSP-SF-5011-350 3.50
ICT-TC-GFSP-SF-5011-400 4.00
ICT-TC-GFSP-SF-5011-550 5.50
ICT-TC-GFSP-SF-5011-600 6.00
ICT-TC-GFSP-SF-5011-1000 10.00
* Subject to change and errors excepted.