ICT-TCC-ALN

ICT-TCC-ALN-200 - truly an optimal solution when it comes to efficiant cooling for high-power electronic power.

Maximum performance combined with high packing density (leading to minimal space) automatically leads electric components to develope high temperatures. To protect the components, the use of the TIM that matches the needs of the application the most, has to be used because the heat released in the process must be reliably dissipated. At this point the ICT-Südwerk comes into play: with our high performance suppliers in matters of aluminiumnitrid ceramic we can supply the ICT-TCC-ALN-200; a product with outstanding isolating characteristics and a very high thermal conductivity (≥ 180 W/mK).

Ceramic discs are typically used from 0,5 to 2,0mm or more thicker depending on the user specification.

Despite the high thermal conductivity there is a general problem. For optimum connection of the power component to the heat sink, either a metallization is required or a TIM in the form of heat conducting paste or heat conducting adhesive. Because the optimal thermal path, i.e. the heat transfer, is only guaranteed if the thermal barriers are reduced.

Our Tipp: Use pure phase-change materials without substrate carriers.

ICT product variants that are ideally suited for this case:

• ICT-Xp45-4W-14R | series

or the TC-Fill-up-STICK  product variants

• ICT-BAR-In- (oder Ac) -19G / 001 oder
• ICT-PEN-In- (oder Ac) -19G / 001