Technical Ceramics
ICT-TCC-ALO
formerly ICT-ALO
Thermally Conductive Technical Ceramics ICT-TCC-ALO-96
ICT-TCC-ALO-96 and 99 (S) has excellent thermal properties combined with mechanical stability and high electrical insulation.These are also the mainspring to use ceramic materials wherever an improved thermal conductivity is required.
ICT- ALO-96 and -99 (S) can be excellently processed with all commercial thick layer pastes due to the excellent surface quality of both sides and are even suitable for many thin applications (sputtering).
Despite the high thermal conductivity, there is generally the problem that for optimum connection of the power component to the heat sink either a metallization is required or a TIM in the form of thermal paste or heat conducting adhesives has to be applied on the interface. Because the optimal thermal path - the heat transfer - is only guaranteed if the thermal barriers are reduced.
Our tip: Use phase change material without substrate carrier. This ICT product variant is ideally suited here:
- ICT-Xp45-4W-14R | series
or combined with both Fill-up StICK product variants:
- ICT-BAR-In- (or Ac) -19G / 001 or
- ICT-PEN-In- (or Ac) -19G / 001
Product properties for ICT-TCC-ALO(*)
| Thermal Properties | |
|---|---|
| Operating temperature | from -65 to 850 °C |
| Thermally conductive | Yes |
| Thermal conductivity | 25.00 W/m*K |
| Thermal resistance (inch² / 645,16mm²) | 0.12 K/W |
| General Properties | |
| Density | 3.8 g/cm³ |
| Color | White |
| Material | Aluminium-oxid Aufbau |
| Electrical Properties | |
| Dielectric strength | 15 kV (AC) |
| Electrically conductive | No |
| Mechanical Properties | |
| Hardness | 9 Härte (nach MOHS) (Elastizitätsmodul) |
Variants
| Specification | Thickness (mm) |
|---|---|
| ICT-TCC-ALO-8002-0.5 | 0.50 |
| ICT-TCC-ALO-8002-0.65 | 0.65 |
| ICT-TCC-ALO-8002-1.0 | 1.00 |
| ICT-TCC-ALO-8002-2.0 | 2.00 |
| ICT-TCC-ALO-8002-3.0 | 3.00 |
