ICT-Up60
Phase Change Materials (electrically insulating)

ICT-Up60

Phase-Change-Material ICT-Up60

The latest generation with a 40% better performance in the total thermal performance


Based on the principles of Kapton MT® + (Dupont), but with almost double of thermal conductivity compared to the standard Kapton MT series the ICT-Up60 SERIES utilizes the combination of the benefits of prosperous manufacturer Phase Change technology and its increased efficiency in the polyimide film technology.

By the development of this unique formulation, the phase-change compound already provides a very efficient thermal transmission through phase-change at normal operating temperatures, while maintaining a uniform bonding line during the expansion process.
With the result that the air is expelled efficiently and  surface irregularities or flatness conditions exist across the interface also can be minimized.


The ICT-Up60 SERIES can be produced in two different thicknesses and therefore comprises a total of two units:

ICT-Up60-L05-KP1 und ICT-Up60-L05-KP2

The connection of thermally conductive Kapton® MT+-film as heat-conductive substrate carrier and uniform thickness coating of the thermoplastic, thermally conductive ICT-Up60 on both sides, guarantee an efficient thermal transfer before and during phase change, as well as during normal operating temperatures during operation. An efficient thermal connection to the contact surfaces is only possible by the implementation of an absolutely uniform coating of the ICT-Up60 phase change material on both sides of the subtrate liner.

Through the development of this unique formulation, the ICT-Up60 already offers a very efficient thermal transmission by phase change at normal operating temperatures, where a uniform connection line is maintained during the expansion process.

The result is that air is efficiently expelled and therefore any surface irregularities or flatness conditions that are present on the interface can be minimised.

With the help of this thermal interface solution, for example, discrete semiconductors, LEDs, microprocessors or any other type of heat generation can be successfully deheated. With the different available material thicknesses it is also possible to cover a wide range of non-electrically insulated power supplies.

Only through efficient and reliable contact connection between heat generation and heat sink can an optimal thermal be carried out in the heat sink or the housing tray.

Product properties for ICT-Up60(*)

Thermal Properties
Operating temperature from -60 to 140 °C
Thermally conductive Yes
Thermal conductivity 0.78 W/m*K
Thermal resistance (inch² / 645,16mm²) 0.780.85
Electrical Properties
Dielectric strength 7,1 kV (AC)
Electrically conductive No
General Properties
UL flammability rating 94 VO UL
Color Yellow

Variants

Specification Thickness (mm) K/W/Inch2
ICT-Up60-L05-KP1 0.03 0.780
ICT-Up60-L05-KP2 0.05 0.850
* Subject to change and errors excepted.