Cooling Solutions
Are you looking forthermally conductive material? You're exactly in the right place, because ICT SUEDWERK GmbH by Wolfgang Reitberger-Kunze is your reliable supplier from Oberhaching, Germany.
ICT SUEDWERK GmbH offers holistic thermal solutions for cooling, especially for power semiconductors and active electronic components in power electronics. Technical and institutional consulting as well as the most modern in-house production complete our portfolio.
Thermal Interface Materials
Overview: Available Material and Format Options
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Featured Products
ICT-TCC-ALN
ICT-TCC-ALN-200 is a aluminiumnitrid-based ceramik material and the high-performance solution when it comes to efficient cooling for high-power electronic power. ALN ceramic is distinguished by its particularly high strength and very high thermal conductivity.
ICT-TCC-ALO
ICT-TCC-ALO-96 and-99 is a ceramic material based on aluminium oxide ceramics with a purity of 96% to 99%, which is characterized by a particularly high strength and thermal conductivity.
ICT-TC-GFSP-SF-5011
Silicone-free TPE thermal pad with 3.0 W/mK conductivity, excellent electrical insulation, low outgassing, soft and compressible.
ICT-TC-GFSP-SF-HP-5030
High-performance, silicon-free gap filler pad with 7.00 W/m·K thermal conductivity, excellent insulation, and low outgassing.
ICT-TC-GFSP-SF-EP-5042
Silicone-free premium gap filler pad delivering 17.0 W/m·K thermal conductivity with excellent electrical insulation and very low outgassing.
